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VOL. I · EST. 11.2025 
SatyaDheesh
सत्याधीश
India's Ground Truth Record
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Government aims to make 3-nanometre chips by 2032; achieve self-reliance in 75% tech categories in 4 years

GS3Economy · S&T · Environment · Security· IT, AI, semiconductors & computing· Prelims + Mains·

Why in news

Union Minister Ashwini Vaishnaw announced the second phase of the Design-Linked Incentive Scheme aiming for 3-nanometer chip manufacturing by 2032 and 70-75% domestic tech design by 2029.

Background

The government aims to manufacture 3-nanometer chips by 2032 under the second phase of the Design-Linked Incentive Scheme. The initiative targets six chip categories: compute, RF, networking, power, sensor, and memory.

Facts for Prelims

  • S&T3-nanometer chips: Target manufacturing goal for India by 2032
  • SchemeDesign-Linked Incentive Scheme: Government initiative to develop semiconductor design ecosystem
  • FactTarget: 70-75% of technology products to be designed and manufactured domestically by 2029
  • FactSix key chip categories: compute, RF, networking, power, sensor, and memory

For Mains

Q. Discuss the significance of developing a domestic semiconductor design ecosystem for India's technological sovereignty and industrial growth.

Dimensions to cover in your answer

  • Supply chain resilience: Reducing dependence on global foundry monopolies for high-end 3nm chips
  • Incentive structure: Balancing fiscal subsidies with private sector R&D investment in niche chip categories

Keywords: Semiconductor ecosystem · Technological sovereignty · Design-Linked Incentive · Import substitution · Strategic autonomy

Read the full news →Report a mistake in this noteHow notes are madeSource: The Hindu ↗Also: GS3 · Industry, investment & MSMEs

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